VisionICs(芯视界)

3D ToF

VI4310

VisionICs releases a single photon imaging sensor features a monolithic single photon imaging detector array of 19k pixels (160 rows by 120 columns) with integrated 3D imaging electrical circuits. The SoC provides the high-performance and cost-effective solid-state Lidar and 3D imaging solutions. Based on visionICs' single photon detection and direct Time-of-Flight (ToF) technology, the sensor could output 3D cloud point data with centimeter distance resolution. Actual detection range depends on the laser optical power and optics field-of-view. Measurement data is transferred via SPI. High reliability and robust can be achieved by removing the mechanical scanning system. The sensor is capable of working at outdoor environment, thanks to the on-die ambient light suppression algorithm


Features
Imaging Array:
-160x120 array
- Active area: 3900x3000 μm²
- Die size: 6379x5260 μm²
- Pixel Pitch: 18.8 μm (vertical), 21.4 μm (horizonal)
- Frame rate: scalable up to 120 FPS
Optical Properties:
- SPAD PDE: 5%@ 940nm
Distance Measurement
- Range: up to 15m
- Range resolution: 0.75cm
- Measurement accuracy: ±1%
On-Chip Calibration
- Ambient light suppressing
- System level calibration for non-linear signal distortions
Digital Interface:
- Configuration: I2C, up to 200kHz
- ToF output: 11 bits DVP, up to 75MHz
Power Supply: 1.5V/3.3V/28.5V
Optimized Optical Package
-COB
Operating Temperature: -20℃ to 65℃
Storage Temperature: -40℃ to 105℃

Applications
Advanced Driver Assistance System (ADAS)
SLAM for robotic vacuum
3D machine vision
Security and surveillance
Gesture controls
Augmented and virtual reality
Collisions avoidance for UAV (Unmanned Aerial Vehicle) & AGV (Automated Guided Vehicle)
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