VisionICs(芯视界)

3D ToF

VI4330

VisionICs releases a single photon imaging sensor features a monolithic single photon imaging detector array of 76.8k pixels (320 rows by 240 columns) with integrated 3D imaging electrical circuits. The SoC provides the high-performance and cost-effective solid-state Lidar and 3D imaging solutions. Based on visionICs' single photon detection and direct Time-of-Flight (ToF) technology, the sensor could output 3D cloud point data with centimeter distance resolution. Actual detection range depends on the laser optical power and optics field-of-view. High reliability and robust can be achieved by removing the mechanical scanning system. The sensor is capable of working at outdoor environment, thanks to the on-die ambient light suppression algorithm.


Features
Imaging Array:
- 320x240 array
- Active area: 4800x3600 μm²
- Die size: 6789x6980 μm²
- Effective Pixel Pitch: 15x15 μm²
- Frame rate: scalable up to 30 FPS
Optical Properties:
- SPAD PDE: 5% @ 940nm
Distance Measurement
- Range: up to 15m
- Range resolution: 0.75cm
- Measurement accuracy: ±1%
On-Chip Calibration
- Ambient light suppressing
- System level calibration for non-linear signal distortions
Digital Interface:
- Configuration: I2C, up to 200kHz
- ToF output: MIPI-CSI2, DVP
Power Supply: 1.5V/3.3W/28.5V
Optimized Optical Package
- COB
Operating Temperature: -20℃ to 65℃
Storage Temperature: -40℃ to 105℃

Applications
Advanced Driver Assistance System (ADAS)
SLAM for robotic vacuum
3D machine vision
Security and surveillance
Gesture controls
Augmented and virtual reality
Collisions avoidance for UAV (Unmanned Aerial Vehicle) & AGV (Automated Guided Vehicle)
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